Domestic memory chips are booming, and representative companies include Hefei Changxin (DRAM) and Wuhan Yangtze Memory. A few days ago, the Korean research institute OERI pointed out in a report that the gap between China and South Korea in DRAM chip technology is about 5 years, and the NAND flash memory chip has been shortened to 2 years. It is reported that YMTC will start mass production of 64-layer 3D NAND in August 2021, only two years later than Samsung and SK Hynix. As for the more advanced super-200-layer 3D flash memory, Samsung and SK Hynix will need to wait until early next year, and YMTC is expected to do so by 2024. However, the report believes that there is a variable that if Apple really introduces YMTC chips for its products such as the iPhone, it may play a role in breaking the industrial chain. .
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