The X670 will consist of two chips, as AMD has already confirmed, and MSI is now showing this as well. There are two chip packages on the mainboard, which are apparently identical in construction and thus only double the features. The B650 simply omits a chip.
MSI has been quite reliable lately when it came to preliminary information about Ryzen 7000 and in the Insider Stream there seems to be little concern about the long-term relationship with AMD, although fingers have been raised. In the Insider Stream you could already see the X670 chip without a heat spreader and AMD is getting a little closer to the term chipset here. Traditionally, it was made up of Northbridge and Southbridge. In the course of further development, it became an I/O hub. AMD now makes two chips out of this again. This had already been confirmed, but not shown, and MSI is doing it on a mainboard from the company – without a heat spreader; you can see it separately. The good news first: The active fan is history.
The saying “less is more” may not really fit, but AMD, it is said, has made the design of the chipset, which can now be called justifiably so, simple. B650, X670 and X670E should all come from one design. The two chips from the chipset should also be identical. For simple mainboards you would simply omit one and only have half the equipment. B650 mainboards are simply half an X670, says Michiel Berkhout from MSI in the live stream, if functions are not artificially cut. “It’s just a doubling of connectivity,” explains colleague Eric Van Beurden. “Basically, it’s two chips that together offer twice the features.”
AMD is thus consistently continuing along the path that has already been taken. After having to pull your own design out of a hat because Asrock was behind schedule, you decided on a pragmatic approach with the partially deactivated I/O hub of the CPU. Now duplicating a design for the I/O hub is basically the chiplets approach. With a singular design, implementation is easier, as is production. And above all, as far as the current status is concerned, it should further upgrade the cheaper B models.
As MSI mentions in the stream, for reasons of space you will hardly see X670 mainboards in ITX format and possibly also few in MATX format, because X670 means not only the two chips but also the more complex power supply of up to 170 watts TDP/230 watts PPT . How the topic develops with the sometimes quite resourceful mainboard manufacturers will have to be seen.
Source: MSI (youtube)
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