AMD has announced that the Zen4-based Ryzen 7000 series processors will launch three motherboard chipsets, including X670E, X670, and B650. During the Taipei Computer Show, many motherboard manufacturers also showed new products through various channels. board. MSI is undoubtedly the most active, publicly introducing the installation method of the Ryzen 7000 processor, the first official channel to expose the real body of the new U, and also confirming the AMD EXPO DDR5 memory overclocking technology. This is not over yet, MSI is the first to show the X670E motherboard without the heat sink, and it shows the legendary dual-chip, which confirms the previous rumors. This is also the first time in the history of the motherboard. However, unlike what was expected, the X670E does not integrate and package the two chips on the same substrate, but simply and rudely places the two X670s on the motherboard, similar to the former dual-core graphics card. The good news is that the heat generation of the X670E should not be large. MSI does not use a fan, but uses a heat pipe to cover the two chips. Neither AMD nor the motherboard makers have revealed the specific specifications of the X670E, except to say that there will be a large number of PCIe 5.0 lanes to support graphics cards and SSDs. .
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