At 14:00 this afternoon (May 23), AMD will hold a theme event for the opening of the Taipei Computer Show. From the preheating point of view, the protagonists of this event will be the 5nm Zen 4 Ryzen 7000 processor, X670/B650 chipset motherboard, etc. . Before the press conference, the relevant content seems to have leaked. It is reported that the Zen 4 processor adopts a small chip design, in which the computing core (CCD) is 5nm and the I/O Die is 6nm, which is a huge improvement compared to the previous generation’s 7nm+12nm. At the same time, it has been confirmed that the integrated RDNA2 GPU unit and the DDR5/PCIe 5.0 controller have an advanced low-power architecture design. In addition, the second-level cache (per core) of the Zen 4 processor has been increased to 1MB, doubling that of the previous generation; the single-thread performance has been increased by more than 15%, the maximum acceleration frequency has exceeded 5GHz, and the AI acceleration instruction set has been expanded. In fact, a lot of the above information has been confirmed in previous revelations. It is expected that the first batch of Zen 4 processors announced by AMD will have at least four models, namely Ryzen 9 7950X, Ryzen 9 7900X, Ryzen 7 7800X, Ryzen 5 7600X, of which 7950 .
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