IT House April 22 news, Shengmei Semiconductor Equipment (Shanghai), a supplier of wafer process solutions for semiconductor front-end and advanced wafer-level packaging (WLP) applications, announced today that the 18-cavity 300mm Ultra C VI single Wafer cleaning equipment has been successfully put into mass production. The device, which was first launched in the second quarter of 2020, has now been validated and entered mass production on the production line of a major memory chip manufacturer in China.
Introduction of Shengmei Shanghai 18-cavity 300mm Ultra C VI Equipment
Compatible with most wet cleaning and wet etching processes
The 18-cavity 300mm Ultra C VI equipment can be used for polymer removal, cleaning for tungsten or copper processes, pre-deposition cleaning, post-etch and post-chemical mechanical polishing (CMP) cleaning, deep trench cleaning, RCA standard cleaning, and many more front- and post-processing.
Efficient transmission, maximum production capacity
The 18-cavity 300mm Ultra C VI equipment is equipped with an efficient wafer transfer system composed of multiple robotic arms, with a maximum capacity of over 800 wafers/hour. Compared with the existing 12-chamber Ultra CV equipment of Shengmei Shanghai,The number of cavities and production capacity have increased by 50%, while the width of the equipment remains the same, but only a small increase in length.
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