AMDRuilong will be officially announced at Computex next week7000The processor is up, this generation will upgrade5nm Zen4Architecture, performance soared, nowAMDThe chip packaging and testing partner Tongfu Microelectronics also confirmed that the company has now achieved5nmThe process capability and certification of the product will help in the futureCPUHigh-end advanced customers.
Tongfu Microelectronics said that with years of technology accumulation and continuous R&D investment, the company hasChipletMass production capacity of packaging;
existCPU,GPUbased on the server field7nmadvanced5nmis currently implemented5nmThe process capability and certification of the product will help in the futureCPUHigh-end advanced customers.
Tongfu Microelectronics is the fifth largest chip packaging and testing company in the world and the second largest in China.2016acquired inAMDPackaging and testing factories in China and Malaysia85%shares, isAMDOne of the most important chip packaging and testing partners,AMDof7nmRyzen5000They are also responsible for the packaging and testing.AMDContributed revenue accounted for2021annual revenue45%the cooperation agreement of both parties has been signed2026year.
From the statement of Tongfu Microelectronics, they have achieved5nmThe process capability and certification of the product should refer toAMDUpcoming Ryzen7000processor, this generation will continue to giveAMDChips provide packaging and testing services.
Hashtag: AMDCPU processor 5nm
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