Brokerage institutions: the application of advanced packaging is accelerated, and the CAGR of the ABF substrate market will reach 29% in the next three years

The latest analysis of foreign brokerage institutions pointed out that due to the successive introduction of advanced packaging into chips such as servers and GPUs for PCs, the compound annual growth rate of ABF carrier boards has been higher than expected.CAGR (compound annual growth rate) is expected to reach 29% between 2022 and 2025.

The newly released NVIDIA server GPU Hopper, AMD RDNA 3 PC GPU, etc. will all be packaged in 2.5D this year, and NVIDIA PC GPUs will follow AMD’s pace in the next few years, coupled with Apple’s M1 Ultra CPU, driving the demand for ABF carrier boards continued growth.

The agency also pointed out that from 2022 to 2025, the area and quantity demand of ABF substrates will continue to grow faster than the supply growth rate, of which the industrial demand CAGR will reach 28%, while the production capacity CAGR in the same period will only be 23%. in addition. Of the new capacity for high-end ABF substrates put into production between 2022 and 2025, 90% will be used for high-end applications, mainly products with more than 12 layers. During this period, the CAGR of high-end BAF substrate production capacity reached 56%, which means that the market upgrading trend in this range has accelerated.