According to the State Intellectual Property Office, on May 6, Huawei announced a patent on “chip stack packaging structure, packaging method and electronic equipment”, which further disclosed Huawei’s stacked chip technology, with the application publication number CN114450786A. This patent was applied for as early as October 30, 2019. The inventors are Zhang Tonglong, Zhang Xiaodong, Guan Yong, and Wang Simin. This patent describes a chip stacking packaging structure, a packaging method, and an electronic device, which relate to the field of electronic technology and are used to solve the problem of how to reliably bond multiple sub-chip stacking units to the same main chip stacking unit. The chip stacking package structure comprises: 1. a main chip stacking unit (10), which has a plurality of main pins (11) which are insulated on the first surface and are arranged at intervals; 2. a first bonding layer (20), which is arranged on the first surface On one surface; the first bonding layer (20) includes a plurality of bonding components (21) that are insulated and spaced apart; 3. Each of the plurality of bonding components (21) includes at least one bonding portion (211) , any two bonding parts (211) are insulated and arranged, and the cross-sectional areas of any two bonding parts (211) are the same; 4. .
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