On June 4, according to Kyodo News on June 3, Denso Corporation, a subsidiary of Toyota Motor Group, announced its goal on the 1st, saying,Increase the sales of semiconductors produced by the company by 20% from the current 420 billion yen to 500 billion yen (about 25.7 billion yuan) by 2025. The company produces “power semiconductors” that focus on power control and “analog semiconductors” for monitoring batteries, etc.In the future, the development of sensors for autonomous driving will be promoted..
According to reports, in order to achieve stable procurement of semiconductors, Denso will also deepen cooperation with professional manufacturers. In February, in order to stably purchase semiconductors,Denso announced that it will invest in a subsidiary established by Taiwan Semiconductor Manufacturing Company (TSMC) to enter Kumamoto Prefecture.
In addition, UMC also announced that USJC, the company’s Japanese subsidiary, will cooperate with DENSO to manufacture automotive power semiconductors.And will build an IGBT production line for DENSO.
in,DENSO will provide its system-oriented IGBT components and process technology, while USJC provides 12-inch wafer fab manufacturing capacity, and is expected to achieve mass production of IGBT process on 12-inch wafers in the first half of 2023. This collaboration has been supported by Japan’s Ministry of Economy, Trade and Industry’s Necessity Semiconductor Carbon Reduction and Retrofit Program.
At the time, DENSO President and CEO Koji Arima said, “DENSO is pleased to be one of the first companies in Japan to start mass production of IGBTs on 12-inch wafers. With the development of mobility technologies, including autonomous driving and electrification , semiconductors are becoming increasingly important in the automotive industry. Through this collaboration,We have contributed to stable supply of power semiconductors and automotive electronics. “
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