In time for Dr. Su Zifeng’s speech at Computex at 14:00 tomorrow afternoon, the X670 series motherboards compatible with Zen 4 Ryzen 7000 have already rushed ahead. The leaked models include X670E GODLIKE, X670E ACE, X670E Carbon WIFI, X670P-WIFI, among which X670E Carbon WIFI uses 18+2 phase 90A direct power supply, X670P-WIFI is 14+2 phase 80A power supply. In terms of interfaces, although there is no USB 4, HDIMI 2.1, DP 1.4 HBR (4K 120Hz), 2.5G network port, support for Wi-Fi 6E, etc. are also very practical. According to the current news, the first Zen 4 Ryzen 7000 will be available in X670E (Extreme), X670 and B650. The perspective view confirms that the X670 is a dual-core (dual south bridge) design, and the B650 is a traditional single-core. The dual core will obviously bring more heat, but the advantage is that it has more stable and more channels of PCIe 5.0, I/O interface and other support. .
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